Hi,
I have used hot gun to solder TMP006 on my new board. The hot gun is Steinel 3483. It was set to 310 degree. Solder flux was applied before soldering. I am not sure the flux type. But PCB was not cleaned as far as I knew. Afterwards, I tested TMP006 in a stable enviroment. The calculated object temperature changed from 9 degree to 16 degree even if target object temperature was stable. The range seemed larger than what I expected. So I suspected that there must be something wrong with solder or something else.
Now I look into TMP006 SBOU108. It states PCB cleaning is mandatory in section 5.4. So I guess the problem was caused by flux or residue. Is my guess right? How much does flux or residue impact on temperature accuracy?
BRs,
Luo