Both the HDC1000 and HDC1008 are bottom ported devices. These devices are under consideration for an industrial application where it is necessary to seal the enclosure the device is mounted in and connect the sensor port to a hole in the exterior surface of the enclosure. The bottom port location is mechanically cumbersome in this case. Can you say if TI has roadmap intentions to bring out devices in the future that are top ported, or, do you have any recommendations on mechanically coupling the sensor port to the exterior of an enclosure - app notes, etc would be helpful.
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