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TMP708 EOS event

Patrick Chen
Mastermind 8875 points
Other Parts Discussed in Thread: TMP708, TIDA-00302

Hello,

              TMP708 is testing fail on customer factory. The cause of failure looks EOS event. Do we have any document or application note to suggest customer to avoid EOS event? Thank you.

BR

Patrick

  • 0
    TI__Genius 14825 points
    Patrick,
    We would like to know more about the failure to be able to make a recommendation. What pins are being stressed? What is the behavior before and after the EOS event? Is it catastrophic?

    Generally we recommend ferrite beads, tranzorbs, diodes and zener diodes to protect devices. Depending on which pins are the ones getting stressed, those may not be options. If you have a schematic to share, we could review it.
  • 0 in reply to Jason Bridgmon
    Mastermind 8875 points

    Hello Jason,

                      it is pin 4 and pin 5 short and damage after EOS. Please refer to below schematics. Do you have any comments for it? Thank you.

    BR

    Patrick

  • 0 in reply to Patrick Chen
    TI__Genius 14825 points

    Patrick,

    Check out TIDA-00302.  It's a TI Design about transient robustness for current shunt monitors, but many of the principles still apply.  Depending on how the EOS event is happening - like if the supply voltage has a transient that exceeds the Absolute Maximum Rating for those pins, then you can clamp down those spikes with the types of passive components discussed in TIDA-00302.  I think a tranzorb in parallel with C1 would probably make the solution more robust overall.