We are currently prototyping with the TMP007. The application involves "looking" down on the target object from above, and in certain conditions, heat from the target object will actually cause die temperature to rise several degrees. So, two questions:
1) Any ideas on ways to "shield" the part from this heat without "blocking" the thermopile's "view" of the target object (unfortunately, heat rises and the orientation of the sensor and the target object can't easily be changed)?
2) I get some very erratic temperature readings when the die temperature rises a few degrees C (which is expected). I assume that the right course of action would be to recalibrate at the new temperature (or at least load a new set of coefficients pre-calculated for the higher temperature), but how do I know when this is necessary? For example, what would tell me that the temperature could no longer be relied on? Or is the recalibration "trigger" just based on a certain percentage change in the die temperature?
--Eric