Hi support member,
We would like to mesure peltier unit with LMT70.
Top of LMT70 package is touched to peltier unit.
Above can measure the temperature.
Bottom of the the package can be touch to the unit through PCB or thin film, also.
Which is better solution for good response?
If you have any comment, would you inform us?
Regards, Hirotaka Inoue
Hi Hirotaka,
We recommend the LMT70 to be mounted on a PCB with copper pads on the opposite side connected with thermal vias. The heat is collected with the pads and is then routed through the thermal vias and is absorbed with the BGA's. This provides a better thermal path and thermal response than through the plastic on the top of the package. This method also protects the IC package from any possible damage.
-Michael Wong
