Hello ,
what is the package type and package body material for the device TMP112AQDRLRQ1 ..??
and also please share the details for the following ,
1. contact finish :
2. lead finish:
3. solder composition :
Thanks & Regards
Goutham Sharma
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Hello ,
what is the package type and package body material for the device TMP112AQDRLRQ1 ..??
and also please share the details for the following ,
1. contact finish :
2. lead finish:
3. solder composition :
Thanks & Regards
Goutham Sharma
This information is available in the Quality section of the product landing page.
TI part number | Part number type | RoHS status | RoHS conversion date1 | Green status | Green conversion date1 | Package | pins | Assembly site | Lead/ball finish | MSL/reflow ratings | Mass (mg) |
TMP112AIDRLT | Std | Y | 01-Feb-2009 (DC 0906) | Y | 01-Feb-2009 (DC 0906) | DRL | 6 | Ext-Mfg | CU NIPDAU | Level-1-260C-UNLIM | 3.2 |
Ren