Alternative package for the PGA900?

Dave LePine48

Other Parts Discussed in Thread: PGA900, PGA400-Q1

The PGA900 seems to be only available in a PVQFN package, which is large and subject to the "Enhanced Package" wirebond life limitation due to kirkendall voids.

For spacing concerns, but also to avoid the wirebond life limitations, can the PGA900 be made available in a DSBGA package?

over 9 years ago

0 Matthew Sullivan over 9 years ago

TI__Intellectual 2895 points

Dave,

There are currently no intentions to put the PGA900 in any other package. The best option for you if you need a BGA package is the PGA400-Q1.

What amount of wirebond lifetime are you looking for in your application?

0 Dave LePine48 over 9 years ago in reply to Matthew Sullivan

Prodigy 90 points

Thanks, but the PGA400-Q1 has only 16bit of ADC, compared to the 24b in the PGA900, so the PGA400-Q1 isn't helpful.

We're designing a product that operates at 125°C and also to meet IEC 61508 Functional Safety. In the assessment of MTTF, the wirebonds lifetime becomes the #1 limiting factor, and at 125°C, severely so.

What kind of volume would it take to get the PGA900 in a smaller package? (volume, I assume, but NRE if necessary?)

0 Matthew Sullivan over 9 years ago in reply to Dave LePine48

TI__Intellectual 2895 points

Dave,

Can you contact me directly to discuss this? m-sullivan@ti.com

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Alternative package for the PGA900?