IWR1443BOOST: IWR1443BOOST:

Hi hittx,

TI will not be providing any RF models of the IWR1443 or IWR1642.

However, the only reason a designer would need the IWRx RF model, like in an Ansoft HFSS format, would be to redesign the BGA landing and GCPW fan-out for a different RF stack-up. If a designer can accept the given Boosterpack stack-up and resulting RF BGA footprint and GCPW transmission-line, then there is no need for the IWRx RF models.

My suggested flow if you need to perform a new RF simulation for a new antenna is this:

• Start with the Boosterpack EVM RF stack-up (layer 1 and layer 2), RF footprint and GCPW fan-out
• Choose a point along the existing GCPW fan-out (something like 40 mil (1mm) from the BGA pad as shown below) and use this as the reference plane for a new design - your simulation starts from that reference plane

• Design your etched antenna assuming the same stack-up and assuming you will need to mate up to this GCPW

• Design an appropriate impedance match transition (if needed) between the etch antenna and the existing GCPW - for example, the Boosterpack antenna use Microstrip feed line, but are transitioned to GCPW.

• Extend the existing length of GCPW from your reference plane to your antenna. As long as the GCPW fan-out is kept short (see the TX GCPW as an example) and the critical dimension (signal width, air-gap and via spacing) are maintained, then these can be extended with minimal effect on loss and matching. 

This use of the existing stack-up lets you use all of the existing design work as a spring-board but lets you transition into any etch antenna design you can make using the existing stack-up. 

Please let me know if that answers your question. 

Thank you,

Randy

Hello hittx,

Since we have not seen activity on this thread in over a week we are considering this post closed. Please open up another post if you have further questions.

Thank you,
Randy