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AWR1243BOOST: Questions about AWR1243 Boost PCB

Adam Yao94020
Genius 10910 points
Part Number: AWR1243BOOST
Other Parts Discussed in Thread: AWR1642

HI champion,
    My customer checked the document 'AWR1642-BOOST-011-Stackup.pdf'. They have below questions about it. Could you help to check them?

  1. What is the difference of base thickness and processed thickness? Why they are different in some layers?
  2. Why the dielectric constance of FR4 between layer 3 and 4 (4.28) and layer 5 and 6 (3.79) is different? What is the impact to the circuit?
  3. What ist he meaning of copper coverage?

Thanks,
Adam

AWR1642-BOOST-011-Stackup.pdf

  • 0
    TI__Guru 58035 points
    Hello Adam,
    The base thickness is the material starting thickness and during manufacturing process the thickness could be changed. This is the final processed thickness. For example in the top and bottom layer the laminate would have some copper thickness to start of with, but the PCB manufacturer would do copper plating above it and hence the processed copper thickness would increase. The final processed thickness is the one that would be present in the final PCB.
    The FR4 dielectric could be different for different FR4 materials. The FR4 between L3 and L4 is a core material while others are prepeg, hence the dielectric is different. Also The L6 FR4 dielectric would be different because its a different thickness core.

    Regards,
    Vivek