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AWR1642: Typical power consumptation and junction temputure in different ambient temputure

Adam Yao94020
Genius 10910 points
Part Number: AWR1642

Hi champion,
    My customer has concern about working temputure of AWR1642. They asked whether we have typical power and junction temputure in normal use case in the -40 to 125 ambient temputure.

Thanks,
Adam

  • 0
    TI__Guru 58035 points
    Hello Adam,
    The datasheet has the typical 50% duty cycle average power consumption (table 5-4). Its around 2W power. At a lower duty cycle the power would be lower.
    About the temperature increase , this would depend on the heat sinking capability provided in the end equipment. Just from the device perspective the table 5.9 in the datasheet provides the thermal resistance characteristics.

    Regards,
    Vivek
  • 0 in reply to Vivek Dham
    TI__Genius 10910 points
    Hello Vivek,
    I see the temperature increase should be discussed case by case regarding customer's board.
    Did we test the typical temperature in TI EVM when running mmw demo? Another question is that the -40 to 125 in the datasheet impay the range for junction temperature or ambient temperature?

    Thanks,
    Adam
  • 0 in reply to Adam Yao94020
    TI__Mastermind 37500 points
    Hello Adam,
    As Vivek describes junction temperature Tj is specified in datasheet section 5.1.
    Heat rejection is based on the customer implementation of through package lid to heat sink, or through device balls to board, to heat sink.

    There is a typical estimate of the device power, in table 5-4. There is an online calculator to help with estimating the device power in a customer usecase. Section 5.9 in the datasheet has the package thermal resistance table. So if you picked a package top heatsink, with a typical 2Tx 4Rx power of 2.3W, the device temperature , if the customer heatsink has a temperature of 85C, using our table, the device Tj (junction) temperature is estimated at Tj = (TspJt * 2.3w) + 85C = 96.3C

    The device lasts longer (POH calculation) for electromigration failures, if the Tjunction temperature is below the maximum typically 105C.
    www.ti.com/.../sprabx4.pdf

    Regards,
    Joe QUIntal
  • 0 in reply to Radio-Joe
    TI__Genius 10910 points
    Hello Joe and Vivek,
    Thanks a lot for your help.It is very helpful.

    Best regards,
    Adam