TMP107-Q1: TMP107 sensor sensing die location

David Nyarko

Part Number: TMP107-Q1
Other Parts Discussed in Thread: TMP107, TMP116

I have a couple of questions relating to the actual temperature sensing die.

1) Would it be possible to know where the actual temperature sensing area is located?

2)Are one or more of the chip pins better at reflecting the true temperature as indicated from the sensing die.

These answers could aid in determining the best chip placement and orientation for accurately monitoring a surface/device temperature.

Thanks

over 6 years ago

0 Ren Schackmann over 6 years ago

TI__Mastermind 40575 points

Hi David,

The sensor is based on semiconductor properties. The chip itself is the sensing element. See en.m.wikipedia.org/.../Silicon_bandgap_temperature_sensor

All of the pins help to transfer heat into the chip. Depending on the leadframe design, some pins may have more metal area inside the package than others. I don't think there is a pin on TMP107 SO package which is larger than the others. I can't check until after the US holiday.

Thanks,
Ren

0 David Nyarko over 6 years ago in reply to Ren Schackmann

Expert 1595 points

Ren,
Thanks. have a great thanksgiving holiday and i hope to hear more from you after your holiday.
David

0 Ren Schackmann over 6 years ago in reply to Ren Schackmann

TI__Mastermind 40575 points

The pins at the corners of the package (1, 4, 5, 8) provide the best thermal path, but it is not a significant difference. This is due to the metal for these pins having more area inside the plastic molding than the other pins. These pins are shown with enlarged landing pads in the datasheet's Figure 44 Layout Example.

A device like TMP116, with its exposed thermal pad or 'heat spreader,' provides the best thermal path to the sensor.

Ren

0 David Nyarko over 6 years ago in reply to Ren Schackmann

Expert 1595 points

Thanks a lot for the response

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TMP107-Q1: TMP107 sensor sensing die location