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LM61: Soldering Condition

yoshihiro hirata
Expert 1425 points
Part Number: LM61
Other Parts Discussed in Thread: LMT87, LMT86,

Our customer is considering to use LM61(SOT-23) or LMT86(SC-70) or LMT87(SC-70).
Please let me know about their questions.

Do LM61(SOT-23), LMT86(SC-70) and LMT87(SC-70) have a recommended soldering plofile?

Best Regards,
Y. Hirata

  • 0
    TI__Expert 6745 points
    Yoshihiro-san,

    I will need to check on this and get back to you.

    -Kelvin
  • 0
    TI__Mastermind 31710 points
    Hi Yoshihiro-san,

    Thank you for reaching out to us. We do not have a specific reflow profile because the reflow profile is based on the your board density, thickness, and size as well as the soldering paste. Therefore, we normally recommend customer to use the standard reflow profile for lead-free which come from the soldering vendor. The devices itself doesn't affect very much. Attached is the apps note for WSON.

    www.ti.com/.../snoa401r.pdf

    Aaron
  • 0 in reply to Aaron Heng
    Expert 1425 points
    Aaron-san,
    Thank you for your quick reply.

    I'm sorry. I change question.
    Are LM61(SOT-23), LMT86(SC-70) and LMT87(SC-70) used flow for mounting?

    I thought that soldering condition mean flow.
    They use flow for mounting. (They can't use reflow for mounting)
    So first question was ineptness.

    Best Regards,
    Y. Hirata
  • 0 in reply to yoshihiro hirata
    TI__Mastermind 31710 points
    Hi Yoshihiro-san,

    Reflow is a electronic term that represent the soldering process when the PCB has the solder paste on the contact pads with the components on top on the PCB. This will go through the reflow machine in order to mount the components intact on the footprint. To answer your question, you need to use the reflow soldering to mount the component as well as handed-solder.

    Let me know if you have further question.

    Aaron
  • 0 in reply to Aaron Heng
    Expert 1425 points
    Aaron-san,

    Thank you for your a lot of supports.
    Is there a problem to use flow(wave solder) for mounting?

    Best Regards,
    Y. Hirata
  • 0 in reply to yoshihiro hirata
    TI__Mastermind 31710 points

    Hi Yoshihiro-san,

    I'm sorry for the long delayed response. We had TI holiday last Friday in observance of Spring Holiday (Good Friday). Since both packages SC70 and SOT23 of the pins are exposed on the board. I don't see a problem when customer wants to mount the devices using wave soldering machine. In this process, there is an extra step where epoxy is needed to hold the devices in place before you can run through the wave soldering machine.

    Hope this helps. Let me know if you have further question.

    Aaron