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IWR1443BOOST: EVM stack up information

Koichiro Tashiro
Mastermind 22915 points
Part Number: IWR1443BOOST

Hi,

I have a customer who is interested in mmWave and started to looking into TI documents.
They found PCB stack-up (IWR1443BOOST_Rev-A-Stackup.pdf) and have below questions.

http://www.ti.com/general/docs/lit/getliterature.tsp?baseLiteratureNumber=sprr253&fileType=zip

In upper table:
Q1) There are two thicknesses(Base and Processed) for each layer.
What does they mean?
Q2) Why IteqIT layer is double-deck ?
Q3) What does the “Description” mean, name of materials ?

In lower table:
Q1) Please explain what does this table mean. This is not easily understandable.

Thanks and regards,
KoT

  • 0
    TI__Mastermind 37500 points

    Hello,

    I have answers for some of these questions.

    Utilizing the IWR1443BOOST_Rev-A Stackup.pdf 

    Q1) the Base is the initial thickness, before the board is pressed together.

           the Processed thickness is after the board is pressed

    Q2) Prepreg layer - see discussion "www.pcbcart.com/.../layer-stackup.html " 

    the resin and weave of the resin provide the mechanism to combine the layers.

    L1 (top copper), 4mil core, and L2 (GND) are combined with the other layers.  There is a balancing L6 (bottom) 4mil core, L5 (GND) on the PCB.   

    The two internal Layers L3, L4 are separated around the core, and there are two prepreg - resin / adhesive layers.

    The double thickness depends on the PCB construction.  Different PCB houses have specific mechanical rules that can vary the processed thickness.

    Q3) Description - this is the material that the PCB board layers are made of.  Each of them has a datasheet, and is selected for a specific purpose:

         1) RF surface layer, core, and GND layer - Rogers material 4835 4mil core, Lo Pro

         2) Iteq 180A top and bottom prepreg pairs - this has resin and weave to combine the Rogers, Copper planes, Core 28mil.

             thickness and Iteq 180A - this is PCB design house thickness.

         3) Layer 3 Copper to Core to Layer 4 Copper has a different impedance from the Rogers 4835 L1, L2, and L5 Cu to 4mil ITEQ108A to L6 Cu.

         4) double layer Prepreg - provides more bonding adhesive than a single layer

    Q4) The table at the bottom discusses for critical signals on the schematic RF Tx, RF Rx, and LVDS differential pairs.   

    Regards,

    Joe Quintal