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HDC2010: Washing the HDC2010 with a warm DI water Rinse?

Part Number: HDC2010


We are soldering the HDC2010 DSBGA package using a tacky flux only and not solder paste. This allows enough flux content for the balls to solder and collapse properly, however we would like to wash away the post reflow flux residue with a warm DI water rinse only, no solvents. Will this be OK as long as the chip is allowed to dry out and settle back to ambient conditions, which may be days?

Thanks, Mark

  • Hi Mark,

    There are specific guidelines to follow when soldering the device onto the PCB. This is explained in the document attached at the end of this email for reference, but the gist of it is that the soldering temperatures should not exceed 260C and NO-CLEAN solder paste should be used when placing the HDC device on a PCB. No solvents and liquids are to be used on or around device after assembly.

    The HDC2010 device incorporates the sensing mechanism on the bottom of the device, which increases the risk of contamination if any liquid or solvent is used to clean on and around the device. With the post above, it's possible that the DI water will wash contaminants into the sensor location.

    The link to correct Storage and Handling guidelines for HDC devices can be found at:
    www.ti.com/.../snia025

    Best Regards,
    Matt
  • Thanks for the quick response Matt!
    How about if we've already exposed the chip to that process?
    They appear to be functioning, but is their accuracy and potential functionality now compromised?
    Mark
  • Hi Mark,

    One way to verify if the sensors received any damage is to compare the results with all devices for a specific humidity reading. Do you have the ability to verify an exact humidity level via chamber test? Is the reading consistent across all devices? Following the guideline helps reduce the risk of contamination exposure.

    Best Regards,
    Matt