We are soldering the HDC2010 DSBGA package using a tacky flux only and not solder paste. This allows enough flux content for the balls to solder and collapse properly, however we would like to wash away the post reflow flux residue with a warm DI water rinse only, no solvents. Will this be OK as long as the chip is allowed to dry out and settle back to ambient conditions, which may be days?
Thanks, Mark