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OPT3001: Need to bake this device?

Noriyuki Takahashi
Genius 10980 points
Part Number: OPT3001

Hi team

Is this device needed to be baked?

I am worried about they need to bake OPT3001 to keep the accuracy stable, because I hear that some competitors need to be baked.

Regards,

Noriyuki Takahashi

  • 0
    TI__Mastermind 25895 points
    Hi Noriyuki,

    The package of the device can have issues if there is moisture present and it is soldered because the moisture can get into the package and then during soldering it can cause issues. However, the device should ship with no moisture and have a moisture indicator. If all guidelines are followed in terms of time after removing IC and shelf life then you should be okay to not bake. If the device gets moisture then you will need to bake.

    I would like to confirm on this however so please give me some time to do this and get back.

    In the datasheet 12.1 Soldering and Handling Recommendations has more details and links to another doc that has even more details.

    Also this www.ti.com/.../spraby1.pdf

    OPT3001 is MSL Level-3

    Best,

    Alex
  • 0 in reply to Alex Bhandari-Young
    TI__Genius 10980 points
    Alex,

    Sorry for late reply and thank you for your answer.
    I just want to confirm whether this IC needs to be baked, because I heard some competitors' light sensors need to be baked to keep the accuracy after soldered on the system.

    Regards,
    Noriyuki Takahashi
  • 0 in reply to Noriyuki Takahashi
    TI__Mastermind 25895 points
    Hi Noriyuki,

    If the moisture requirements are followed that I mentioned above then no bake is needed.

    Best,

    Alex