Customer did some tests to determine the temperature sensitivity of the PADC in the PGA900:
The approach was to place a PCB in a climate cabinet and sample the PADC count at different temperatures (P_GAIN = 400). We had the pressure cell lying outside the climate cabinet in room temperature connected to the PCB with wires. So the cell output should be constant.
The results are shown on the graph below and it seems like there is a fairly linear relation between the chip temperature and the resulting PADC count.
So the question is, how much variation can we expect to see in this temperature sensitivity from one chip to the next and chips from one batch to the next?
Regards, Bernd
