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HDC2010: Manufacturing consistency of HDC2010 sensor

Yang Wu
Expert 3320 points
Part Number: HDC2010
Other Parts Discussed in Thread: HDC1080, HDC2080

Hi Team,

My customer has some confusions about HDC2010 as below:

1. the datasheet says [The sensing element of the HDC2010 is placed on the bottom part of the device, which makes the HDC2010 more robust against dirt, dust, and other environmental contaminants].

Is this the only reason that makes the sensing element be placed on the bottom part of the device? I note that the sensing element of HDC1080 is placed at the top of the device.

2. Due to the fact that the sensing element on the bottom, Is there a problem of  manufacturing consistency (Because the sensing part is on the bottom of device, the IC can't be tightly welded on the PCB, some place need to be reserved)?

Thanks a lot.

Loop in our customer.

Best regards,

Yang

  • 0
    TI__Mastermind 43785 points

    Hi Yang,

    1. The HDC2010 is a DSBGA package. The die is always flipped upside-down for this package technology. The HDC1080 and HDC2080 are in a traditional WSON package with opening.

    2. Yes, some customers struggle with solder assembly of DSBGA packages, but this is not unique to HDC2010. HDC2010 humidity performance will be affected by faulty solder assembly.

    Thanks,
    Ren