Hi:
I want to use PGA900 SBGA. Then I find a problem, the gap of pad is only about 0.2mm. The minimum via hole is 0.2mm , that mean there is no enough gap between via and pad.
How do TI suggest to set size of via in layout for PGA900 ?
thanks
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Hi:
I want to use PGA900 SBGA. Then I find a problem, the gap of pad is only about 0.2mm. The minimum via hole is 0.2mm , that mean there is no enough gap between via and pad.
How do TI suggest to set size of via in layout for PGA900 ?
thanks
Hello,
My apologies for the delay. This has taken longer than expected. I will get back to you as soon as I am able to get a layout example ready.
Regards,
Hello,
Is the minimum via hole constrained by your manufacturer or by something else? Even with a 0.2mm via there should be enough room between the balls on the bottom of the PGA900. The minimum distance between two balls is about 0.2mm, but there is much more space outside of the area directly between them. In the center of 4 balls the distance between 2 of them is about 0.4mm, which allows plenty of space for a via without shorting two pins. See below: