HDC2080: Maximizing temperature response time.

Jason Gardner

Part Number: HDC2080
Other Parts Discussed in Thread: HDC2010

Hello,

I want to make sure I maximize the temperature response time of the HDC2080. I read both http://www.ti.com/lit/an/snoa967a/snoa967a.pdf and

http://www.ti.com/lit/an/snoa966b/snoa966b.pdf.

From those documents I plan on using a two sided pcb and creating a heat island to decouple the HDC2080 thermally from the PCB. However, if I want to get a maximum response time it seems that creating a no solder mask copper pad connected to the DNP is the way to go. The copper pad would be exposed to the ambient air and thermally couple the air temperature directly to the DAP and on to the die. It would act as a large "temperature collector" of sorts due to the high thermal conductivity of copper.

Is this a good idea?

Regards,

Jason

over 5 years ago

0 Ren Schackmann over 5 years ago

TI__Mastermind 43855 points

Hi Jason,

To get the fastest response, you want the lowest mass. If the addition of copper can make a good path to the object being measured, then it is worth it to add it. However, it seems your goal is to measure ambient, therefore you should not create any thermal paths.

thanks,

ren

0 Jason Gardner over 5 years ago in reply to Ren Schackmann

Intellectual 730 points

Ren,

Thanks for the prompt response.

So I'm sensing that the best way to improve the thermal response time is to use a smaller part (HDC2010) and make the cutout "island" around the part as small as possible. Additionally, using the smallest FR4 "bridge" to the main part of the PCB is the way to go.

True?

Jason

0 Ren Schackmann over 5 years ago in reply to Jason Gardner

TI__Mastermind 43855 points

Hi Jason,

Yes, that is true. A cutout is recommended for ambient air measurements.

thanks,

Ren

Sensors

Sensors forum

HDC2080: Maximizing temperature response time.