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LMT70: Thermal conduction

Gregory Duperon
Expert 7490 points
Part Number: LMT70

  • In the application notes, the heat is always transferred to the sensor through the balls through the PCB. Can the heat be transferred through the top of the die?
  • If yes, how much will it affect the accuracy?
  • Is it possible to have the LUT table from the datasheet in  Excel, .csv, etc. format?

  • 0
    TI__Genius 9675 points

    Hi Greg,

    You can absolutely transfer heat through the top side of the die, and the BGA package would be the right one for doing so. This is because of the low junction to case thermal resistance. There will be no affect on the accuracy of the device.

    For the LUT table, I'll have to search for an excel file and loop back around on that.

    Thanks,

    Jalen