Hello,
I am working on a new product where I need both temperature and humidity sensors.
I ended up narrowing down to my selection to HDC2080/HDC2010/HDC1080.
Can you please help me to list out technical differences among these 3 available products?
Thank you for your support and help.
Regards,
Krunal
Dear Krunal -
Thanks for your post and here below i have put the main points I would consider important when comparing these devices - hope this helps you out.
From electrical standpoint -
The HDC10x0 family have input voltage from 2.7VDC to 5.5VDC, whereas the HDC20x0 family supports input voltage of 1.62VDC to 3.6VDC.
From packaging standpoint -
HDC1080 and HDC2080 are both six pin WSON packages from which one layout will support both devices (if 2.7VDC - 3.6VDC is input voltage)
HDC2010 is six pin DSBGA package (for ultra compact designs)
From firmware standpoint -
the HDC2010 and HDC2080 are identical, have an automatic mode setting, threshold alert settings and interrupt pin feature to support ultra-low-power consumption designs, where the MCU or MPU needs to go to sleep and can support being woken up by the HDC sensor. All three parts are very simple to operate over I2C at either 100kHz or 400kHz data rates.
From a power consumption standpoint -
All three devices are very low current draw, but the HDC1080 is order of magnitude slower than HDC20x0 devices when making measurements (mSec versus uSec) and does draw a bit more average current.
The second link below compares the three devices side by side, using the 'Compare' button feature on ti.com, starting from here: 
Hello Josh,
First thing first - thank you for a quick response and providing the info I requested.
So it appears that selection of a product really depends on what voltage range and package is needed in end application.
From accuracy perspective they all offer same accuracy.
Could you please help me understand why HDC2080 and HDC1080 offer different packaging look from the top compared to HDC2010? See below screenshot I attached.
Do HDC2080 and HDC1080 offer any unique benefits compared to HDC2010 when we see top side of the package?
As I mentioned, we are developing a new product where continuous temperature and humidity sensing are needed. Do you have any documents that explain how to mechanically design the product when HDC2080, HDC1080, HDC2010 is used?
Dear Krunal -
In addition to the information in the respective datasheets, we also have this document:
Section 2.4 (which starts on page 15) has layout examples for both styles of packaging. The HDC2010 has the opening on the bottom of the device as compared to the top. This mechanical arrangement will prevent or greatly reduce any chance of external contamination over the lifetime of the product, but does require the PCB assembly process to be able to handle the style of package (wafer chip scale / die-size ball grid array (DSBGA), as it is a little more fragile than a WSON/DFN - which is pretty common these days worldwide, but still not as ubiquitous of a capability as "normal" surface mount.
