IWR1843: Footprint padsize of IWR1843

Niklas Cooke

Part Number: IWR1843

Hi,

Is it possible to do a via in pad of a outer diameter of the via of 0.35mm? The standard footprint padsize states 0.32mm.

Niklas

0 CHETHAN KUMAR Y.B. over 5 years ago

Niklas,

Via on the pad is done only for the RF grounds, for this

Pad dia = 350 um (layer-1) & Hole dia = 150 um is acceptable.

You could refer to the EVM layout for more details (It is from Altium Design package)

Thanks and regards,

CHETHAN KUMAR Y.B.

0 Niklas Cooke over 5 years ago in reply to CHETHAN KUMAR Y.B.

Hi again,

The IWR1843BOOST design does not have uvia in pad.

My question is if we can place a 0.35mm uvia over the BGA pad which is 0.32mm?

And then, do we have to change all of the other BGA pads sizes to 0.35mm to match the ones with via in pad?

Niklas

0 CHETHAN KUMAR Y.B. over 5 years ago in reply to Niklas Cooke

Hi Niklas,

IWR1843BOOST does have uvia on the pad.

Please refer to EVM layout (snapshot shown below ), this has 12.6mil pad and 5.9mil drill (Micro via ) from Top layer to Layer 2 only.

Thanks and regards,

CHETHAN KUMAR Y.B.

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