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IWR1443: IWR1443 SDK 2.o

Part Number: IWR1443

Hello,

I'd like to inquire about an incomprehensible phenomenon regarding the internal temperature sensor value of IWR1443.

Reading the internal temperature with SDK 2.0 at room temperature, the value of DIG0 is found to be 90℃, which is much higher than other sensors values. All other sensors have values of less than 55℃.

Is it normal that the temperature difference is greater than 35℃ at the same Die? 

If this is normal, we cannot adopt this chip in our application because it easily exceeds the junction temperature 105 ℃ at an ambient temperature of 45 ℃ or more.

Best Regards,

  • Hi Yunkwon,

    I believe this is a known issue.

    We will have more information for you in a few days.

    Regards,

    AG

  • Yunkwon Jung,

         This is not expected, It is not normal to have temperate difference greater than 35 Deg C within the die for a typical chirp configuration, Do you see this phenomenon on other IWR1443 devices? or only on one device?  

    We could expect few degree variations across the die, and it could have different values based on number of Tx and Rx configuration and Chirp configurations. It would be good to take average value the all the temperature sensors. 

    Thanks and regards,

    CHETHAN KUMAR Y.B. 

         

  • Dear CHETHAN KUMAR Y.B.,

    Thank you for your comment.

    We have checked 4 IWR1443 samples at room temperature..

    Two samples have temperature difference of 35℃. Another one has 28℃ difference (DIG0 & DIG1 :82℃, the other sensors : less than 54℃).

    The last one has 21℃ difference (DIG0 & DIG1 :74℃, the other sensors : less than 53℃).

    Best Regards,

    YK Jung

  • Hello YK Jung,

        Thanks for the confirmation, Junction temperature is the function of chirp configuration and duty-cycle (i.e. Ratio of "Active chirp period" vs Total Frame period). What is the duty-cycle used in the application. Could you please post the chirp configuration?  

    Do you see this behavior when you run out of box demo configuration? 

    Thanks and regards,

    CHETHAN KUMAR Y.B.

  • Dear CHETHAN KUMAR Y.B.,

    The configuration used for the test is below. We did not use Tx2, but Tx1 and Tx3.

    sensorStop

    flushCfg

    dfeDataOutputMode 1

    channelCfg 15 5 0

    adcCfg 2 1

    adcbufCfg 0 1 0 1

    profileCfg 0 80 7 3 24 0 0 40 1 128 6200 1 1 34

    chirpCfg 0 0 0 0 0 0 0 1

    chirpCfg 1 1 0 0 0 0 0 4

    frameCfg 0 1 16 0 50 1 0

    Best Regards,

    YK Jung

  • Hello YK Jung,

       Changing Tx1 and Tx3 should not be problem. 

    But, Chirp parameter seem to be different from out of box demo.

    Could you please re-check if this problem is present? 

    Thanks and regards,

    CHETHAN KUMAR Y.B.

  • Dear CHETHAN KUMAR Y.B.,

    Thank you for your kind reply.

    In order to secure performance for various application purposes, the chirp parameter must be able to be changed.

    So what I want to know is, in what case is the temperature values of DIG0 and DIG1 much higher than other sensor values?, and what is the guidance to lower these temperature values?

    This is very important and urgent for our development project. I hope to have the answers to the above questions soon.

    Your answers will be appreciated.

    Best Regards,

    YK Jung

  • YK Jung,

         In IWR1443 we have only one Dig temp, could you please clarify this? 

    It is possible there could be some trimming issue on the Dig temp sensor on very few batches of the devices, We could check on them if you could provide the die-id information?  

    Thanks and regards,

    CHETHAN KUMAR Y.B.

     

  • Hi CHETHAN KUMAR Y.B.,

    We have checked  the internal temperature sensors of 3 other samples. I attach the sample information and temperature values below.

    1. Sample #1

    Platform          : xWR14xx

    mmWave SDK Version      : 02.01.00.04

    Device Info             : IWR14xx non-secure ES 03.00

    RF F/W Version          : 02.00.00.01.17.10.05

    RF F/W Patch            : 01.02.00.00.18.09.14

    mmWaveLink Version      : 01.02.00.00

    Lot number              : 8617892

    Wafer number            : 5

    Die coordinates in wafer: X = 35, Y = 426

    RX0 :  47 degree C, RX1 :  46 degree C, RX2 :  47 degree C, RX3 :  47 degree C

    TX0 :  49 degree C, TX1 :  49 degree C, TX2 :  50 degree C

    PM  :  48 degree C, DIG0:  79 degree C

     

    2. Sample #2

    Platform          : xWR14xx

    mmWave SDK Version      : 02.01.00.04

    Device Info             : IWR14xx non-secure ES 03.00

    RF F/W Version          : 02.00.00.01.17.10.05

    RF F/W Patch            : 01.02.00.00.18.09.14

    mmWaveLink Version      : 01.02.00.00

    Lot number              : 8617892

    Wafer number            : 5

    Die coordinates in wafer: X = 35, Y = 368

    RX0 :  52 degree C, RX1 :  53 degree C, RX2 :  52 degree C, RX3 :  51 degree C

    TX0 :  52 degree C, TX1 :  52 degree C, TX2 :  54 degree C

    PM  :  53 degree C, DIG0:  74 degree C

     

    3. Sample #3

    Platform          : xWR14xx

    mmWave SDK Version      : 02.01.00.04

    Device Info             : IWR14xx non-secure ES 03.00

    RF F/W Version          : 02.00.00.01.17.10.05

    RF F/W Patch            : 01.02.00.00.18.09.14

    mmWaveLink Version      : 01.02.00.00

    Lot number              : 8617893

    Wafer number            : 5

    Die coordinates in wafer: X = 21, Y = 14

    RX0 :  47 degree C, RX1 :  47 degree C, RX2 :  47 degree C, RX3 :  48 degree C

    TX0 :  50 degree C, TX1 :  50 degree C, TX2 :  49 degree C

    PM  :  48 degree C, DIG0:  74 degree C

    Please let me know if you need any other information.

    Best Regards,

     

    YK Jung

  • YK Jung,

       Thank you for providing die-id information. I will check with our product engineering team with this information. This may take few days to extract information from the database. Thanks for your patience and understanding.

    Thanks and regards,

    CHETHAN KUMAR Y.B.

  • Hello YK Jung,

       I have updated information on this. I did follow up with our Product Engineering team with the above Die-id.

    And they have confirmed based on the die-id, on these units there is a issue of Temp-sensor trimming which will impact the Dig0 temperature sensor readings. 

    Hence, on these units please exclude Dig0 temperature sensor and make use of other temperature sensors within the die.

    Thanks and regards,

    CHETHAN KUMAR Y.B.

  • Hello CHETHAN KUMAR Y.B.,

    I really appreciate your help.

    Best Regards,

    YK Jung