Other Parts Discussed in Thread: LMT70, TMP117, TMP116
Dear Sir
I would like to ask about Layout Temperature Sensing PAD I want to increase the temperature sensing PAD size
Which pin should I connect to the IC? Thank you
This thread has been locked.
If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.
Dear Lin -
Welcome to E2E!
Please follow the layout recommendations in the datasheet and see this application note, and apply recommendations given here, based on your application use case (seems as though the shared ground plane near a heat generating IC measurement would be best for you - sections 3.1.1 and 3.1.2) https://www.ti.com/lit/an/snoa967a/snoa967a.pdf
Dear Sir Josh
Dear Lin -
the application example for this with the LMT70, to do that application use case is here:
http://www.ti.com/lit/ug/tiduay7/tiduay7.pdf and here: http://www.ti.com/tool/TIDA-00721
there is also the TMP116 and TMP117 which have been used in the same way
https://www.ti.com/lit/an/snoaa07/snoaa07.pdf
http://www.ti.com/tool/TIDA-01624
https://www.electronicdesign.com/industrial-automation/article/21807603/designing-to-achieve-medical-temperature-measurement-accuracy