Other Parts Discussed in Thread: IWR6843
hi. this is jiyoung
and currently i'm making RADAR PCB using IWR6843.
see the reference model which is given by TI.
i have some questions.
from the reference design,
the microvias connect 1-2 in the RF part
and there are additional vias to connect L1-L4-L6, but there are just a few and the number of them is 7
i think it's because there are some components are located at the bottom side of PCB.
if there aren't any component and there are many empty spaces, is it better to have 1-8 additional vias as many as possible?
this is my first questions
and my second questions is
from the reference design, second layer is separated into two GND planes.
i think the reason why doing this is be cautious about PWR, DIGITAL noise which can disturb the RF signals
but what about the crystal noise? crystal and RF grounds are connected from the reference design.
is the crystal noise is so higher(25MHz) than IF frequencies so do you think it is unnecessary to consider the noise from crystal?
if there are any considerations or explanations about designing RF PCBs,
please let me know.
i already have a "HardwareDesignCheckList_Vp08_IWR6843"
look forward your reply
thank you:)