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Original question:

TMP103: ball size issue

TMP103: Package SRO

Stefan Ivanov2
Prodigy 30 points
Part Number: TMP103

What is the SRO (Solder Resist Opening) value for the TMP103 package?

Thanks,

Stefan Ivanov

  • 0
    TI__Mastermind 28075 points

    Hi Stefan,

    Welcome to the E2E forums. The landing pattern information for the TMP103 is appended to the end of the TMP103 datasheet, including the solder mask opening. For the NSMD landing pad you would have a 0.23mm diameter copper pad with the solder resist opening at most 0.05mm larger. 

    Best Regards,
    Brandon Fisher

  • 0 in reply to Brandon Fisher94
    Prodigy 30 points

    Hi Brandon,

    Thanks for the prompt response.

    I am aware of the recommended dimensions for the pads and solder mask opening on the PCB at the end of the datasheet. However, our manufacturing engineers would like to adjust those dimensions based on the thickness of my PCB and the actual SRO of the package, so I need to find the SRO on the package side of the BGA balls. 

    Thanks,

    Stefan

  • 0 in reply to Stefan Ivanov2
    TI__Mastermind 28075 points

    Hi Stefan,

    Thank you for clarifying.

    This document gives some insight into the structure of our standard WCSP devices like the TMP103 (see figure 1 below).

    I believe that the UBM (under bump metallization) diameter defines the exposed metal, and would be equivalent to the SRO on a package like this. For the TMP103 the nominal value for UBM diameter is 0.21mm. 

    If this is not the dimension needed, please indicate on one of these figures what dimension you need and I will check with our packaging team.

    Best Regards,
    Brandon Fisher

  • 0 in reply to Brandon Fisher94
    Prodigy 30 points

    Yes, this is the dimension I was looking for.

    Thanks!