IWR6843AOPEVM: Temperature too high when the board was cut

Hello,

When I cut the IWR6843AOPEVM Rev.F and executed "68xx AoP_ODS - Multiple Gesture and Motion Detection", the IWR6843AOP device case temperature was 112.5 [degC].

I'm afraid that the Tj = junction temperature violates the absolute maximum ratings, 105degC.

Then can I ask the followings?:

Q1.

Did you try the same test and measured such a high temperature? Or your result was something different ?

Q2.

If you agree the Tj violation, can I ask the heat is reasonable for the IC product ?

The part is small, very good, but it would be not easy to make a small form factor product.

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Test detail

Hardware:
- IWR6843AOPEVM rev.F.
     - The board was cut and the Mission AOP board side was used.
     - The default heatsink is attached.
     - The board was 20cm above a desk.

- Windows PC to execute a couple of Teraterms (Serial terminal app).

Firmware:
C:\ti\mmwave_industrial_toolbox_4_3_2\labs\gesture_recognition\68xx_multi_gesture_and_motion_det\prebuilt_binaries\aop\multi_gesture_demo_68xx_aop.bin

Test procedure:
- SOP2=ON
- Program the firmware using Uniflash610.
- SOP2=OFF
- USB cable recycle
- Function check:
    - Teraterm1: Hit [Enter], then receives "mmwDemo:/>"  >>> Good.
    - Teraterm2: Receives characters like "URURUR"    >>> Good.

- (Wait for 30 minutes)

- Measure the temperature by an emission thermometer (Yokogawa 53007-J) >>> 112.5 [degC]

- Function check again:
    - Teraterm1: Hit [Enter], then receives "mmwDemo:/>"   >>> Good.
    - Teraterm2: Receives characters like "URURUR"   >>> Good.