Hi Team,
I would like to use TMP117 to measure air temperature near the top of PCBA. There is a heat source from the bottom of PCBA.
For WSON package, TI suggests having two copper planes of equal size to the top and bottom of the exposed pad.
I am afraid of the heat source will affect the temperature measurement via the copper plane on the bottom.
Instead, is DSBGA package is better for the situation? TMP117 can be placed on the top of PCBA with thermal isolation.
Do you have any suggestions on how to implement layout for TMP117?
Thanks.
