IWR6843AOP: 4 layer vs 8 layer board design

Josh Horne

Part Number: IWR6843AOP

I am designing a board using the IWR6843AOPEVM and am wondering if a 4 layer board will be sufficient instead of doing an 8 layer board like in the EVM? I am planning on the 4 layer stackup being Signal, GND, 3V3, Signal. Besides ease of routing, are there considerations like noise, power integrity, heat dissipation, etc. that require the IWR6843AOP to be on an 8 layer board?

over 5 years ago

0 CHETHAN KUMAR Y.B. over 5 years ago

TI__Mastermind 25835 points

Hello Hornej,

It may be challenging to fit everything into a 4 Layer board. It's challenging to fan-out all the BGA signals in 4 Layer substrate. On the EVM it uses all the signals hence it has been difficult to contain it in 4 layer board. There are LVDS signals that needed to be 100ohm transmission line impedance warranted additional layers.

Of course, additional power and ground layers helps in better Signal and Power integrity as well. Another benefit with more layers is thermal, we could disperse heat laterally due to limited area on the EVM. Board size increase could be another alternative without increasing the layer count could be explored.

Thanks and regards,

CHETHAN KUMAR Y.B.

0 Josh Horne over 5 years ago in reply to CHETHAN KUMAR Y.B.

Prodigy 130 points

Ok thank you

0 CHETHAN KUMAR Y.B. over 5 years ago in reply to Josh Horne

TI__Mastermind 25835 points

Hello Hornej,

Thank you for the confirmation.

Thanks and regards,

CHETHAN KUMAR Y.B.

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IWR6843AOP: 4 layer vs 8 layer board design