Hello,
the evm used a solder mask below the complete package. This is not documented in the land pattern (page 72) in the datasheet. Is this needed?
Regards, Holger
This thread has been locked.
If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.
Hello,
the evm used a solder mask below the complete package. This is not documented in the land pattern (page 72) in the datasheet. Is this needed?
Regards, Holger
HI,
Are you referring to the "thermal pad" in below the AOP IC?
Regards,
Charles O
Holger,
If you are referring to soldermask under the AOP EVM is to provide better heat dissipation under the AOP package, so that PTH could be placed and heat could be transferred to the other layers in the PCB.. and also to the bottom side of the PCB, From which additional provision could be provided for the heat sink on that side of the PCB.
For more details you could refer to the. Below appnote
Thanks and regards,
CHETHAN KUMAR Y.B.
Hi,
After checking the appnote, we still have a question about the stencil open.
Refer to the EVM's gerber file, it seems to have the stencil open for the thermal pad.
Our question is, do we need soldering in this thermal pad? if yes, If there is any potential risk when soldering contact the die of IWR6843AOP?
Thank You.
Aaron
Aaron,
This solder mask opening provision is provided for additional heat transfer to the bottom layer.
As of now there is no soldering is planned. In future, If there is additional thermal improvement is desired thermal interface material could be placed between the die and the PCB to transfer heat through this exposed solder mask opening. But this is a just future option on the board not a must have for the mmWave sensor option.
Thanks and regards,
CHETHAN KUMAR Y.B.