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TMP1075: Temp measurement of adjacent FET

Michael Daimer
Intellectual 1745 points
Part Number: TMP1075

Hello,

I am considering the TMP1075 to measure the temperature of an adjacent power FET.

1) Is the Exposed Pad of the WSON package suitable to thermally bind the TMP1075 to the measurement location (i.e. will I measure the EP temperature if all other connections to the package are intentionally thin) ?

2) What are the limits to the Voltage of the EP? In a different Question it was said that the EP may be on GND or Floating. Would it also be OK if the PAD is on a differerent Volatge, e.g. +5, +12 or +60 V or a PWM Signal ?

Can you recommend some app notes or other collateral on how to use digital Temp sensors to monitor the Mosfet temperature?

Thanks and best regards,

Michael

  • 0
    TI__Expert 6820 points

    Hi Michael,

    Below is my feedback.

    Michael Daimer said:
    1) Is the Exposed Pad of the WSON package suitable to thermally bind the TMP1075 to the measurement location (i.e. will I measure the EP temperature if all other connections to the package are intentionally thin) ?

    Yes, this the thermal pad can be used as thermal conduction path to the die and you can limit thermal path to other traces by making the traces thin.

    Michael Daimer said:
    2) What are the limits to the Voltage of the EP? In a different Question it was said that the EP may be on GND or Floating. Would it also be OK if the PAD is on a differerent Volatge, e.g. +5, +12 or +60 V or a PWM Signal ?

    The thermal pad should not be connected to a different voltage level and should only be left floating or connected to GND.

    Michael Daimer said:
    Can you recommend some app notes or other collateral on how to use digital Temp sensors to monitor the Mosfet temperature?

    Here is a link to an app note on how to measure board temperature.  

    Thanks,

    David