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DRV5055: solder profile for QLPGM package?

Robert Finger
Genius 17387 points
Part Number: DRV5055

Hi, 

A customer of mine will use DRV5055A2QLPGM. But the MSL Peak Temp is not stated in the datasheet. Is reflow soldering possible? Which temp profile should be used?

Thanks,
  Robert

  • 0
    TI__Mastermind 21250 points

    Robert,

    The MSL standards in J-STD-020 are specifically concerned with the stresses in the package that come as a result of the high heat exposure that occurs during solder reflow for SMD type packages.  The stress for a SMD type device during the wave reflow process is much greater than for a through hole device. This is due to the fact that only the leads of the through hole device are exposed to the solder reflow, where the actual SMD device is more directly exposed to the solder.  

    That said, I do not know of a particular flow guide just for TO-92, but I would expect that given the tighter requirement for SMD that these profiles might be useful

    https://www.ti.com/lit/an/snoa292j/snoa292j.pdf

    Also, more background and scope of the J-STD-020 requirements can be found here

    www.ipc.org/.../IPC-JEDEC-J-STD-020E.pdf