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PTN78000W: PTN78000WAH

Muhammad Farahein Abdul Rahman
Prodigy 10 points
Part Number: PTN78000W

Tool/software:

Hi TI,

I'm writing to seek technical advise on processing MPN: PTN78000WAH by wave soldering.

As you know, lead shoulder standoff has diameter 70 mil is blocking the PTH hole (57 mil) at the solder destination.

This has caused air trapped not able to be vented out during soldering process has caused insufficient solder reject in the PTH hole.

We seek your help to advise on process recommendation to solder this MPN 

Generally, this standoff design is non compliance to IPC-J-STD-001 under clause 4.8 for our CCA wave soldering process for PTH because solder destination are blocked when this MPN mounted to CCA.

 

Regards,

Farahein

  • 0
    TI__Guru* 78070 points

    Hi Farahein,

    We need to get the advices from our packaging expert, and get back to you ASAP.

    Best Regards,

    Youhao

  • 0 in reply to Youhao Xi
    TI__Guru* 78070 points

    Hi Farahein,

    Just let you know that we are still working on it, and the question is being routed through to the right engineer.  Hopefully we can answer you in the next couple of days.  

    Best Regards,

    Youhao

  • 0 in reply to Youhao Xi
    TI__Guru* 78070 points

    Hi Farahein,

    Sorry for the delay.  I got some recommendations from our packaging expert. Let me copy and paste his advices:

    -----------Quote---------

    Avoiding non-flow air of through-hole components during wave soldering is a comprehensive problem.

    It needs to be considered and optimized in many aspects, including component and PCB design, process parameters, material preparation.

     

    1. component and PCB design stages:

    * Select components with gaps.

    * Optimize through hole size.

    * Avoid oversize pad design.

    * Component pin length.

    * PCB layout considerations.

     

    1. wave soldering process parameters adjustment:

    * Warm up temperature.

    *Soldering temperature.

    *Soldering speed (belt speed).

    *Orbits tilt angle.

    *Use spoiler/turbulence waves.

    *Flux selection and coating.

    *soldering peak height.

    The above items have an impact on the results of wave soldering.  This requires the customer to fine tune it.

    ----------The end of quote--------

    In order to support you, I also search online and get similar suggestions, like bake the board, adequate preheat temperature and time, evenly applying a flux that is compatible with soldering process , and adjusting solder wave parameters like solder wave temperature, speed and depth to ensure proper wetting of components, and prevent excessive solder retention in the through-hole. 

    Hope these help.

    Best Regards,

    Youhao

  • 0 in reply to Youhao Xi
    TI__Guru* 78070 points

    Hi Farahein,

    May I assume the issue is resolved so I can close the thread?  You are welcome to reopen it by adding a new post, or start a new thread.

    Thank you for using our products and good luck in your projects.

    Best Regards,

    Youhao