Part Number: TPS53511
TEXAS INSTRUMENTS_12TH_MAR_26.xlsx. - EXCEL SHEET
Hi TEXAS INSTRUMENTS Team,
As part of our ongoing component compliance review and internal documentation update process, we are currently evaluating TEXAS INSTRUMENTS parts that your organization supplies to us.
Kindly acknowledge receipt of this email and confirm that the work has commenced.
We would appreciate it if you could share the completed information on or before 18TH March 2026.
Thank you for your support.
Note:
Technology Node: Represents the semiconductor manufacturing process generation (in nm/µm), indicating the minimum feature size used in IC fabrication (e.g., 28 nm, 7 nm).
Country of Origin (COO): Provide the final assembly/testing country.
Type of Conflict Minerals: Specify elements (e.g. Tin (Sn), Tantalum (Ta), Tungsten (W), Gold (Au)) are present into component.
CAS Numbers: Provide CAS numbers for substances reportable under RoHS/REACH.
Type of REEs: Specify elements (Lanthanum (La), Cerium (Ce), Praseodymium (Pr), Neodymium (Nd), Promethium (Pm), Samarium (Sm), Europium (Eu), Gadolinium (Gd), Terbium (Tb), Dysprosium (Dy), Holmium (Ho), Erbium (Er), Thulium (Tm), Ytterbium (Yb), Lutetium (Lu), Scandium (Sc), and Yttrium (Y)) are present in the component.
Package Dimensions (mm): Provide dimensions millimeters (mm). Package Dimension = length x width x height
Die Count: Indicate the number of silicon dies in the package.
Die Area (mm²): Provide the die area in square millimeters (mm²).
Die Thickness (mm): Provide the die thickness in mm.
Die Dimensions (mm): Provide nominal die size in mm. Die Dimension = length x width
Die Weight (mg): Provide the die weight in milligrams (mg). Die Weight (mg) = Die Area × Die Thickness × Silicon Density
Siddesh Chavan
