The RGY (16pin VQFN) package version of this part has a thermal pad. There is no indication on the datasheet if this pad should be bonded or not and if so to what. On the NXP equivalent to this part, they state the pad is not connected internally and does not need to be implemented, but if it is, that it should be connected to VCC. This is unusual and in our (we are using the TI part) we have it implemented and have it connected to ground. The part is working as advertised with this implementation. Could you please advise what should be done with this pad on the TI part officially. Please also amend the datasheet accordingly.
1. Should the pad be implemented on the PCB and bonded?
2. If (1) should the pad be? a) floating. b) connected to GND. c) connected to VCC.
3. If the pad is connected internally, what is it connected to? eg. substrate.
Kind Regards,
Dean.
