Tool/software:
Hi.
I have a question regarding the SN74AHC4066RGYR device in the VQFN package.
While the datasheet states that the exposed thermal pad must be soldered to the PCB for thermal and mechanical performance, it does not specify whether the exposed pad should be electrically connected to GND.
Could you please confirm whether it is recommended to connect the exposed pad to GND in this device?
Thanks,
Conor