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temperature spec for TS3A5017

Victor Zhitomirsky
Prodigy 110 points
Other Parts Discussed in Thread: TS5A23157, TS3A5017

We are using TS3A5017RSV part in our design and are testing it for the temperatures up to +105 degree. The part is working absolutely fine. This part is not qualified for this temperature range but its storage temperature is defined up to +150 degree. Should we worry about the risk of the fast degradation of this part in the +105 degree application? We are sending current in the range of few microAmps through the part - so it junction temperature is equal to the ambient temperature.

Also a very similar part TS5A23157 is qualified for the application in the automatovie temperature range up to +125 degree, so it is highly unlikely that there is a physical limitation for using TS3A5017 above +85 degree.

I will appreciate if you will point out for the main risk assosiated with using TS3A5017 at +105 junction temperature.

  • 0
    TI__Expert 6395 points

    Hello Victor,

    The main risk is that the part degrades faster.  There is extensive analysis and testing done when moving a device to automotive grade that ensures the device will perform under the extreme temperature conditions.  Without the data to back it, TI cannot guarantee proper device operation outside of datasheet parameters.   

    As a word of caution, two similar parts can be built on different processes which may have different reactions to temperature extremes.  Packaging is also a very high concern when moving to automotive grade and plays a key role in whether the device succeeds in this area or not.

    Regards,

    Andrew

  • 0 in reply to Andrew_Mason
    Prodigy 110 points

    Andrew,

    It is true that the packaging is a main concern - however the storage temperature is specified up to +150 degree. Thus it is difficult to accept that the packagin itself can cause a problem at +105 degree.

    Thus we are back at the question at the level of the silicon process for the two parts mentioned by me. Is it possible to chesk whether they are made using similar process?

    Regards

    Victor

  • 0 in reply to Victor Zhitomirsky
    TI__Expert 6395 points

    Hello Victor,

    The process flows are different for these devices.

    Regards,

    Andrew