• State TI Thinks Resolved
  • Locked Locked
  • Replies 1 reply
  • Answers 1 answer
  • Subscribers 16 subscribers
  • Views 408 views
  • Users 0 members are here
Support feedback
Options
Options
Related

This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

TS3A27518E: Replacement for EOL BGA package

shashank sharma
Prodigy 515 points
Part Number: TS3A27518E
Other Parts Discussed in Thread: TS3A27518, , TMUX154E, TMUX1574

Hello,

My customer is using TS3A27518 in their new module project and learnt that TI just EOL’ed BGA package. From the PCN we understand that they should use the WQFN package instead. As this module is quite space constraint, we are looking for a replacement that is about same size. Which device do you recommend?

Application for this device is switching SDIO signals between SD card and WiFi module.

Thanks,

Shashank

  • 0
    TI__Mastermind 45575 points

    Shashank,

    The TS3A27518E is the only 6-channel 2:1 device in the current portfolio offering.  The BGA package is 3mm x 3mm (9 mm^2) and the WQN is 4 mm x 4 mm  (16 mm^2). 

    If you want to use multiple ICs to achieve a total 8 mm ^2 solution, you can use a 4-channel 2:1 device like the TMUX1574 1.86mm x 2.60mm (5mm^2) paired with a 2-channel 2:1 device like TMUX154E 1.4 mm x 1.8 mm (3mm^2).

    Another option is using 2x TMUX1574 devices 1.8 mm x 2.6 mm (4.68mm ^2 * 2 = 9.36 mm ^2) 

    Thank you,

    Adam