Hi All,
I couldn't find sufficient info in the data sheet that could solve my query hence posting it here. Hoping to get an answer.
I had tested 10 of these ICs under similar conditions and three of them burnt. I am trying to find the cause for only the three ICs burning since all the ICs were subjected to the same operating conditions; Which, I ensure, satisfy the operating conditions mentioned in the Data sheet.
Section 9.2.2 (Detailed Design Procedure) in the data sheet mentions that "IN, by default is pulled low to ground or can be pulled up for an open-drain GPIO". Now this should mean that IN has to be externally pulled down or Up and it is not internally pulled down by default? Correct me if I am wrong.
If it is not pulled down internally by default, then can the IN pin be left floating?
In my application the IN was not externally pulled down as I thought it is internally pulled down by default (should have paid more attention) which leaves the pin floating if not a Logic High.
The data sheet doesn't mention if the IN pin can be left to float. I suspect this should be the reason for the ICs to burn and that the one's that didn't burn will eventually burn after some time. Could leaving the IN pin floating be the reason for the ICs to burn or can they be left floating? If they can be left floating, what else could have caused them to burn?
Looking forward to the answers.
Thanks