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Boundary scan testing possibility (alternatives)

Nikhilesh Karanam
Prodigy 40 points

Hello,

  • LM5069MM-2/NOPB - Hot swap controller
  • DRV8876PWPR- TI- DC motor driver
  • TPS78410QWDRBRQ1- TI- Analog LDO
  • LM2576- TI- DC-DC converter
  • MAX3221- RS 232 Driver

could you also please refer if these chips can be tested using the IEEE Standard Boundary Scan 1149.1?

or do you have alternative to these chips that are suitable for the desired testing possibility? Thanks.

Regards,

Nikhilesh

  • 0
    TI__Guru** 107891 points

    Hi Nikhilesh,

    Thanks for reaching out!

    Each device belongs to different teams. you need to raise separate threads with device name in the subject so that it reaches right people/team.

    What is the requirement of Boundary Scan 1149.1 ?

    Regards,

    Rakesh

  • 0 in reply to Rakesh
    Prodigy 40 points

    Hello Rakesh,

    Thanks for the Info. I will repost creating new threads as suggested.

    And, with regards to boundary scan, generally the chips that comply with boundary scan testing capability (IEEE 1149.1) are connected with each other in a daisy chain fashion including an MCU unit on PCB. With the help of JTAG, the PCB can then be effectively tested for full functionality, say, inputs and outputs of all the components, soldering issues, routing issues, interconnectivity between the components and so on with no requirement of physical probes nor the program running on the MCU. So, I was wondering if this is possible with these chips? or if there are alternatives with this possibility. 

    Regards,

    Nikhil

  • 0 in reply to Nikhilesh Karanam
    TI__Guru** 107891 points

    Hi Nikhil,

    Thanks for the information.

    As long as the electrical specs are not violated, I don't see any concern in using LM5069MM-2/NOPB for these tests.

    Best Regards,

    Rakesh

  • 0 in reply to Rakesh
    Prodigy 40 points

    Hello Rakesh,

    excuse the delayed response. Well yeah, but when a board is being tested, it would be better that all the important components are soldered properly and interconnected with each other without any manufacturing or design mistakes. Thats the actual goal.

    Regards,

    Nikhil