Hi guys
My question is a general one and related to humidity influencing on integrated circuits. I have read in one scientific article that since silicon nitride passivation is used at manufacturing integrated circuits humidity hasn't been influencing factor for failure rate anymore. Exception is of course bond pad corrosion where humidity is still very influencing. I'm asking this as we have two basic models for accelerating tests - Hallberg-Peck and Arrhenius one. Which one should be preferably used for QC of integrated circuits? If the first why you don't have humidity involved in your temperature failure rate estimator's equation then? Thanks for your answer in advance!
Kr,
Primoz