Hello,
I have a designed a 12KW 3 phase motor inverter using many of the hardware and design circuits from TIDA-00366. The design can be tailored for Scalar, Sensored or Sensorless control by including or emitting components based on consumer requirements. The assembly utilizes 2 main PCB layers. The top layer includes all logic level control and interfacing with sensors and external control systems. The second layer contains high voltage current/voltage sensing for the 3 phases, VBUS voltage sensing, IGBT temperature sensing, IGBT drivers and isolated IGBT driver power supply circuits. The design uses Infineon's IGBT module FS75R12W2T4 that solders directly to the second layer. This helps minimize trace inductances from the IGBT drivers to the IGBT module.
I have reviewed both TI's and Infineon's best practices for IGBT driver to IGBT module trace design requirements. Is it possible for somebody to review the PCB design before I submit the PCB design for manufacturing? (This is my second design attempt after I ran into major issues with Ringing and False Turn On.)
Regards,
