TPSM843820: Thermal Metrics or Multi-Resistor Network

Let me work with my packaging team regarding your thermal model request.  I will respond tomorrow with an update

Hello, 

I submitted a modeling request to my packaging team for a thetaJB and thetaJC numbers with a request date of 11/8.

I also asked about the ansys files capability. 

If we can produce the file, I can share it within the e2e mail system.   Accept my e2e friend request so I can share. 

David,

Thank you for the support. Let me know if you or your team need any additional information from me. I've accepted your request so you can share any files you are able to produce.

Thanks,

Nick

Thanks,  

My modeler has asked for some details regarding the assembly which I provided and for some power dissipation estimates and I provided some data I have. 

He states that the Icepak multi-resistor model can be provided.  But I was curious of your use case, what is the typical use vout, iout and switching frequency.     

Hey David, 

Sorry for the delay. We have a couple different scenarios and these are the conditions that my electrical engineer provided me with:

Let me know if you need anything else to provide the model.

Thanks,

Nick

thank you, I will share the model once I get it

Hey David,

Any update on this effort?

Thanks,

Nick

Hi Nick,

Dave will respond to this between this week and next week.

Thanks,

Calan

The modeling team should have a model at the end of the week

Hey David,

I think I only have one question about application of power. I noticed in the model provided that there was 1W within the junction and 0.5W within the Inductor body. Is this power ratio how I should split total part dissipation, ie 2/3 within the junction and 1/3 within the inductor, or was this just simply for your internal verification purposes when building the model and I should apply all power to the junction?

Thanks,

Nick

Hi Nick,

David will respond next week as he is out of office for Thanksgiving U.S. Holiday.

Thanks,

Calan