Tool/software:
Hi,
I am producing TIDA-010933 reference design and have implemented the PCB stackup as shown in the attached image. The stackup consists of four layers, with material, type, weight, thickness, and dielectric constant specified for each layer.
Could someone please confirm if this stack-up aligns with the TIDA-010933 reference design specifications? Additionally, are there any recommended adjustments or considerations I should keep in mind for optimal performance in high-power applications?
the attached image shows following details
The stackup comprises 4 copper layers (Top, Layer 1, Layer 2, Bottom) interleaved with dielectric layers (Prepreg and Core).
Top and Bottom layers are 2 oz copper, while internal layers (Layer 1 and Layer 2) are 1 oz copper.
Dielectric constants (Dk) range between 3.5 and 4.6
Material FR4- High TG
