Other Parts Discussed in Thread: AWR2243
Tool/software:
Hi All,
I am working on to create a custom PCB board containing two AWR2243s with an some additional logic with it. I am currently reviewing the TIDA-020047 reference design and have some questions about the stack-up and blind via selection.
1- I think, there is a inconsistency in the Gerber PDF file and layer stack up written in the Gerber layer GM12. In the gerber pdf layers are as follows
| Top layer |
| SIG1 |
| GND2 |
| PWR1 |
| PWR2 |
| SIG2 |
| GND3 |
| Bottom Layer |
GM12 layer states the stack up as follows. Which one is the correct one?
2- When doing the via fence in the RF signals, Gerber shows 2 different via types used (100 um/150 um). 150 um vias are used for all RF signals of the AWR2243 inputs and outputs whereas 100 um vias are near the antenna patterns. Is there a specific reason, this choice is selected? Can i used the same vias for every RF signals?
regards
Osman
