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TPS63811: ball size tolerance

Efi Mizrachi
Prodigy 10 points

Part Number: TPS63811
Other Parts Discussed in Thread: TPS63810

Tool/software:

Hello,

We are using TPS63810 - package DSBGA.

At the datasheet (page .40) the ball tolerance can vary between 0.2-0.3mm.

Volume of a sphere with 0.2 mm diameter ≈ 0.00419 mm^3
Volume of a sphere with 0.3 mm diameter ≈ 0.01414 mm^3

  • The 0.3 mm sphere is approximately 237.5% larger in volume than the 0.2 mm sphere.


Is tolerance correct ? 
*while this device  has pitch of 0.4mm and the recommended pad size 0.23 

Thank you,

Regards,
Efi
  • 0
    TI__Mastermind 32350 points

    Hi  Efi,

    Let me check with my colleague first, i am not expert on this topic, thanks for your patience.

    Regards

    Tao

  • +1
    TI__Mastermind 32350 points

    Hi  Efi,

    Thanks for reaching out.

    Yes, the solder ball diameter tolearance 0.2~0.3mm is TI's spec for YFF WSCP device(pitch 0.4mm).

    And 0.23mm is our recommendation. Too small land patter may impact the soldering quality, and too big could result in bridging. So this is a balanced consideration.

    (By the way, this kind of WCSP solder ball design is very mature, and TI had sold many device already). 

    Regards

    Tao