Part Number: MSP430FR2000
We are currently evaluating TI ICs for a high-volume application with a projected demand of 30 million units per year.
We have identified one specific parts in the TI portfolio that meet our technical requirements: [MSP430FR2000 ]. However, we need to confirm if these specific ICs are available in bare die / unsawn wafer format.
Could you please assist us with the following:
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Confirm the availability of the aforementioned ICs in bare die format.
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If these specific parts are not available as die, could you recommend alternative Microchip ICs that are offered in bare die format and meet the following specifications:
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- General Purpose I/O: At least four GPIOs.
- Connectivity: No NFC, RF, or wireless communication interfaces are required.
- Temperature Measurement: Integrated temperature sensor with accuracy better than ±5 °C, with particular focus on performance between -30 °C and +5 °C.
- Time Keeping: An internal Real-Time Clock (RTC) is preferred. If not available, an alternative time-tracking method must achieve a maximum drift of less than 2 hours over a 14-day period.
- Power Management: Support for deep sleep modes with extremely low power consumption. Ideally, GPIO states should be retained during deep sleep (e.g. both GPIOs held at logic LOW / GND).
- Programmability: The firmware architecture must support state-based logic equivalent to the defined operational flowchart, including activation, measurement, sleep, and display update states.
- Wide VDD operating range to support battery voltage variation (e.g. 3.3 V to ~1.0 V). The exact minimum voltage is flexible, but should be as low as reasonably achievable.
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Given the scale of this project, we are looking to establish a long-term supply chain and would appreciate your guidance on the procurement process for this volume.
