TLV7163318 UltraLibrarian file doesn't look right

Ed Walker

Other Parts Discussed in Thread: ADS1298

Using version 6.4.202 downloaded today.
Pushed the BXL file from the TLV7613318 to my desktop.
Download http://webench.ti.com/cad/dlbxl.cgi/TI_BXL/TLV716P_DPQ_6.bxl

The Symbol and Footprint looks corrupted.

I appreciate your assitance in, telling me what I am doing wrong, or how to correct the problem.
ADS1298 is also having the same problem.

over 10 years ago

0 Gerold Dhanabalan - Online Design Tools over 10 years ago

TI__Genius 14455 points

Hi Ed,

Can you explain a bit more on what is exactly corrupt? I tried exporting them to Altium and Eagle and was able to have them exported.

Regards,

Gerold

0 Gerold Dhanabalan - Online Design Tools over 10 years ago in reply to Gerold Dhanabalan - Online Design Tools

TI__Genius 14455 points

TLV716P_DPQ_6.bxl

Hi Ed,

There is an issue with the solder paste in the BXL. I am attaching the updated BXL. It should be available on ti.com shortly.

Is this your observation or are you referring to a different problem?

Regards,

Gerold

0 Ed Walker over 10 years ago in reply to Gerold Dhanabalan - Online Design Tools

Prodigy 5 points

Thanks for the help.
Look at the pictures in the original post.
The left side reference designators are on top of each other.
The right side looks strange also.

The footprint file's dimensions (like from pad to pad) does not seem to match the datasheet's info.
And this also is the same with ADS1298 as mentioned in the original post.

0 Oliver Landine - WEBENCH® Design Center over 10 years ago in reply to Ed Walker

TI__Expert 3055 points

Hi Ed,

The datasheet needs to be updated. I can't see the details on the pad sizes in the bxl footprint (I have an old version of UL, and not enough time to upgrade), but do see the name of the footprint. From the name, I know the dimensions should match this input I received a long time ago from the Package Research Group.

"land pattern I/O pads of 0.45 x 0.2mm, inner
edge row-to-row spacing of 0.7mm, exposed pad
of 0.30 x 0.94mm.

Stencil should have I/O openings 1:1 and
aligned with the pads, exposed pad opening of
0.275 x 0.915mm for an 89% coverage."

If the bxl footprint matches that (and it likely does), it is what we want.

Simulation, hardware & system design tools

Simulation, hardware & system design tools forum

TLV7163318 UltraLibrarian file doesn't look right