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TIDA-01477: Questions re fabrication of Wireless Sensor Reference design

Martin Knott10
Intellectual 260 points
Part Number: TIDA-01477
Other Parts Discussed in Thread: DRV8832, CC1310, TIDA-00484, TIDA-00757, DRV8833, CC2650

Hello,

As an experienced embedded software engineer, I have been developing a smart central heating system for my house as a hobby. My goal is to have a network (Sub-GHz) of temperature sensors and radiator valves. It seems to me that the TIDA-01477 would make a good platform for both the sensor and valve nodes. I have no relevant experience in hardware design. I have approached a PCB fabrication company (ALLPCB) for a quote, and they have asked me the following questions. I was wondering if you could assist me in answering the following:

1. Regarding the Gerber file, pls confirm if we can use our standard stack-up or we should strictly follow your stack-up? 

2. The min drill size is only 0.2mm, could you pls confirm if you can enlarge to 0.3 or at least 0.25mm?

Also, confirm the specification of the board you need, will below be ok? 

4 layers, Size 37.5*75mm, 1.6mm board thickness, green solder mask, white silkscreen, HASL with lead surface, 1oz copper.

In addition, I have my own questions:

1. What is the difference between TIDA-01477 & TI-00484?

2. Can I dispense with the aerial and use an attachment to an external ? If so, how could I go about doing so? I appreciate the aerial design is a very key aspect of a successful radio node.

3. My valve nodes may not require the full power chain, and I would like to have a single board with the principal components of CC1310 microprocessor and a TI DRV8832 motor driver IC. Any suggestions on how to achieve this simply would be appreciated.

Thank you in advance for any assistance you can give.

Best Regards

Martin

  • 0
    TI__Expert 8785 points

    I have another team member to help assist you with the board questions.

    For your other questions:

    1. What is the difference between TIDA-01477 and TIDA-00484?
    If you look in the schematic, you will see two block diagrams.  TIDA-00484 will be the nano-timer power cycled implementation.  In this mode, there is a timer that controls the load switch to periodically power on/off the CC1310.  When the CC1310 powers up, it will quickly read the temperature/humidity, broadcast out the information and then shuts off the power to itself.  TIDA-01477 will be the sensor-to-cloud implementation.  In this mode, the CC1310 is always on and can have constant communication with a central hub/gateway. 

    2. Can I dispense with the aerial and use an attachment to an external?
    Yes, it is possible.  Please look at the antenna portion of the CC1310EMK: http://www.ti.com/tool/CC1310EMK.  This board uses an external antenna

    3. CC1310+DRV8832
    Hopefully, TIDA-00757 can be helpful.  This TID uses DRV8833 (not DRV8832) though.  If you are okay with DRV8833, you can copy the DRV portion of the TIDA-00757 schematic.  The DRV VM/VCP supply voltage can be changed to match your board's CC1310 supply voltage

  • 0 in reply to clam
    TI__Expert 8785 points
    Not sure if you'll find this useful, but there is another reference design www.ti.com/.../TIDA-01067. This is a smart damper that will control the air vents autonomously, based on the environment and air flow pressure. There is also a BLE device on there, so you can manually override the vent opening using your phone. If this meets your criteria, then you should be able to swap out the CC2650 for CC1310, and then replace the on-board antenna with an external (using CC1310EMK as reference).
  • 0
    TI__Mastermind 29511 points
    On 1) we are not sure what they are trying to change in the stack-up, so can't really comment.

    On 2) there are 14 ground vias with that 0.2mm hole size and a diameter of 0.5mm. If you increase the hole size to 0.25mm, the annular ring will decrease to 0.125mm. Check with them if they can build that.

    The board specifications match what our original design, so those are ok.
  • 0 in reply to clam
    Intellectual 260 points

    Thank you for clarifying things, and suggesting many other options. As you will see from this thread, your colleague has addressed the hardware issues.

    Regards

    Martin

  • 0 in reply to Gus Martinez
    Intellectual 260 points
    Hi Gus,
    Thanks for the information, I have asked ALLPCB for details on the STACK-UP. As a novice in PCB design I am not sure what a "stack-up" actually is, so may get back to you if they send me some details. I have passed on your comments re drill size and await their reply.

    Regards
    Martin
  • 0 in reply to Martin Knott10
    Intellectual 260 points

    Hi Gus,

    As promised the ALLPCB stack-up definition. Please confirm whether this meets the requirement for the TIDA-01477 reference design

    Best Regards,

    Martin

  • 0 in reply to Martin Knott10
    TI__Mastermind 29511 points

    Hi Martin,

    We can only guarantee performance on the stack-up used in our original design, however the proposed stack up should work.

    Gus Martinez

  • 0 in reply to Gus Martinez
    Intellectual 260 points

    Hi Gus

    Thanks for the heads-up.

    I think I have all my questions answered for this thread, now. Thanks All.

    Best Regards,

    Martin Knott