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Was is possible to extend feature of the PCB calculator in such context to include various kind of package with thermally enhanced pads, such as TSSOP, QFN and so on.
My name is Sandra Horton and I helped to develop the Thermal Calculator, I'm really glad you like it. The short answer to your question is YES. The calculator is already equipped to handle packages with thermal pads and currently includes devices in QFN, QFP, and powerpad TSSOP amoung others. If there is a particular device you are looking for, please let us know and we will work to have it added to the calculator.
Was is possible to do calculation for me based on software as I need them ASAP
The model adopted in this software is based on single layer PCB which is meaningless for power application where I normally use 4 layer 2oz (70um) copper thickness (1.6mm FR4). Can you generates new charts provided by the software on the following
(a) 4 layer 2oz FR4 PCB
(b) 5400mm2 PCB (JEDEC)
(c) 1500mm2 PCB (Our actual PCB)
(d) Ambient at 25C, no forced air.
I/P power 3W, package QFN 9x9 size with RJA=35C/W and RJB =8C/W. I perfer this to be generic package.
Much appericated and wishing you very happy Xmas.
Richard Payne
Please send result via richardpayne@energyelectronics.co.uk or riscy00@gmail.com
Unfortuantely, the calculator was designed with the current board types and it is not possible to add in additional board designs in the current revision. At this time, we are working to add additioanl TI devices to the current calculator. I will put the board idea up for review for a future release of our tool, but it is not in the plan for this year. Mentor/FloMerics does offer a PCB design tool, have you looked into that?
I am working on TPS61088 boost converter having below requriements. I want to calculate pcb area required for my application and junction temperature Tj for the same. Kindly give you suggestion for the test condition mentioned below.
